The WGM wafer grinding machine grind the wafer trimmings produced during cutting so that the trimmings can be recycled for cream production.
Robust stainless steel design meets the hygiene requirements of the food industry.
Good accessibility for easy cleaning.
The waste wafers pass through a sieve with a diameter of 5 mm, then grinded down to 120 microns thickness by the powerful grinding blades.
Container for wafer trimmings - container lid easy to open for manual addition of ingredients. Product is fed manually through a hinged lid, keeping the operator away from the moving parts. The lid has an interlocking safety switch to ensure safe operation.
